Micron Breaks Ground on $7 Billion HBM Facility in Singapore

Micron Technology, Inc. has initiated the construction of a new High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, reflecting an investment of approximately $7 billion over the coming years. As artificial intelligence (AI) becomes more prevalent across industries, the demand for sophisticated memory and storage solutions is soaring, prompting Micron to expand its capabilities in Singapore, a hub recognized for its strategic position in the global semiconductor supply chain. This new facility is scheduled to begin operations in 2026, with expansions in capacity planned to start in 2027. The project is anticipated to create 1,400 jobs initially, with a prospect of reaching 3,000 roles, encompassing packaging development and test operations. Singapore government officials, including Deputy Prime Minister and Minister for Trade and Industry, were in attendance, underscoring the continued partnership between Micron and Singapore. Micron’s plans will also support long-term manufacturing requirements for their NAND facilities. In line with Micron’s sustainability goals, the facility will incorporate water recycling, waste circularity technologies, and intelligent AI-based automation. The importance of this initiative extends beyond Micron’s growth, as it contributes significantly to the semiconductor ecosystem of Singapore and global AI advancements.